Uncategorized

200 mm semi-/ fully-automated production probe system

• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Faster time to data
• Highest Z-axis resolution of any production prober
• Highest Z-axis resolution of any production prober
• Interfaces to all major analysis instrumentation, optics software and testers
• Backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Highly accurate light measurement

Long-lasting, rugged RF and microwave on-wafer probes

• Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
• DC to 110 GHz models available in single and dual line versions
• Low insertion and return loss with ultra-low-loss ( -L ) versions
• Excellent crosstalk characteristics
• Wide operating temperature -65 ° C to + 200 ° C
• Wide range of pitches available, from 50 to 1250 µm
• Individually supported contacts
• Reduced contact (RC) probe tips for small pads
• BeCu tip provides rugged, repeatable contact on gold pads

• Flexibility
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Use with liquid nitrogen or helium, depending on the target temperature
• Stability
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Precise probe positioning
• Ease of Use
  • Joystick controller
  • Manual probe positioners with rotary feed-throughs
  • Front loading capability through load door
  • Comfortable and easy operation

• Flexibility
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Stability
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Precise probe positioning
• Ease of Use
  • Joystick controller
  • Manual probe positioners with rotary feed-throughs
  • Front loading capability through load door
• High measurement throughput
  • Software control of chuck for fast step-and-repeat testing of the entire wafer
  • Fast step-and-repeat testing of the whole wafer

• Flexibility
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Stability
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Precise probe positioning
• Ease of Use
  • Joystick controller
  • Manual probe positioners with rotary feed-throughs
  • Front loading capability through load door
  • Comfortable and easy operation
• High measurement throughput
  • Software control of chuck for fast step-and-repeat testing of the entire wafer
  • Fast step-and-repeat testing of the whole wafer

• Superior Mechanics
  • Highly stable granite base
  • Fast navigation and high-precision probe positioning
• High Flexibility
  • Re-configurable for DC, RF, mmW, FA, WLR and more
  • Full thermal range of -60°C to +300°C
• Ease of Use
  • Low-profile, straightforward design
  • Spacious top chambers for up to 12 positioners
  • Easy and ergonomic operation
• Shielding
  • Reduces electrical noise by providing a fully electromagnetically shielded, ultra-low-noise, light-tight environment
  • Full thermal range of -60°C to +300°C available

• Superior Mechanics
  • Highly stable granite base
  • Excellent measurement accuracy and repeatability
• High Flexibility
  • Re-configurable for DC, RF, mmW, FA, WLR and more
  • 40 mm platen height adjustability
  • Fast transition between wafer and package test
• Ease of use
  •  Low-profile, straightforward design
  • Easy and ergonomic operation
• Double-side option
  • Front or backside probing capability
  • Access to top side and bottom side of device under test (DUT)

• Superior Mechanics
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Use with liquid nitrogen or helium, depending on the target temperature
• Stability
  • Independently cooled cold shield
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Optional upgrade for 300 mm wafer
• Ease of Use
  • Intuitive, manual drives
  • Front loading capability through load door
  • Comfortable and easy operation
• High measurement throughput
  • Independent control of linear chuck stage and positioners
  • Contact/separation stroke for chuck
  • Fast, manual step-and-repeat testing of the whole wafer

200 mm semi-/ fully-automated production probe system

• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Faster time to data
• Highest Z-axis resolution of any production prober
• Highest Z-axis resolution of any production prober
• Interfaces to all major analysis instrumentation, optics software and testers
• Backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Highly accurate light measurement

with Autonomous Silicon Photonics Measurement Assistant

• Revolutionary technology advancement for wafer and die-level photonics probing
• Enables autonomous measurements
• Highest accuracy in test results
• Reduced risk of damaging fibers with collision avoidance technology
• Easy setup even for less experienced users
• Minimized coupling losses with minimal trench dimensions
• Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
• Other integrated features: Incident Angle Cal, Optical Rotation Scan, Optical Scan Data Analysis, Optical Tracking, Align Optical Probes
• 40°C to +125°C
• Enables hands-free autonomous calibration and re-calibration at multiple temperatures

• Rapid image acquisition
• High resolution imaging
• SQUID sensor autotuning
• Unattended operation
• Sample size
• Closed-loop scanner stage
• Magnetic shielding
• Magnetic field control
• Flexible sensor integration
• Cryogen-free

• Cryogenic Temperaturesy
  • Fully isolated experiment space for true 4K temperatures during probing
  • Cryogenic positioners to provide large travel ranges without warming up the device
• Low Vibration
  • Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
  • A soft vacuum bellows provides a compliant mounting interface for the cryocooler
• Configurability
  • Quick release vacuum feedthroughs for easy configurability
  • A large rectangular port for high signal capacity
  • Multiple stage feedthroughs for thermally intercepting the signals
  • Many available system options and add ons to choose from