The DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering highly accurate and repeatable on-wafer electrical measurements (IV, CV, LFN). It uses MEMS technology to measure advanced devices (2, 3, 5 nm) on various pad materials, micro-bumps, and pads as small as 20 μm, reducing the need for retesting and cleaning while covering the full thermal range at lower testing costs. Compared to traditional probes, the DCP-X provides 1000x lower contact resistance, minimal skate, and over 500,000 contact cycles, ensuring precise measurements and longer probe life.
