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  • The DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering highly accurate and repeatable on-wafer electrical measurements (IV, CV, LFN). It uses MEMS technology to measure advanced devices (2, 3, 5 nm) on various pad materials, micro-bumps, and pads as small as 20 μm, reducing the need for retesting and cleaning while covering the full thermal range at lower testing costs. Compared to traditional probes, the DCP-X provides 1000x lower contact resistance, minimal skate, and over 500,000 contact cycles, ensuring precise measurements and longer probe life.

    • Compact, air-cooled OEM style
    • Superior pulse repeatability
    • Simple parallel operation for higher power
    • Optional Active PFC (pf = 0.98)
    • Full remote control interface
    • High EMI-RFI immunity

     

    • Advanced semiconductor technology
    • High-quality construction
    • Rapid capacitor and pulse-forming network charging
    • Compact and lightweight design
    • Simple parallel operation for higher power needs
    • Compatible with worldwide input voltages and frequencies
    • Fully adjustable output voltage
    • Comprehensive remote control interface

     

  • High-Speed Current Control: No dynamic overshoot or oscillation
    High Slew-Rate: Up to 30A/*s for fast load changes
    Low Voltage Operation: Stable operation with no turn-on delay
    Multi-Functional: Seven load modes and four operating modes
    Parallel Operation: Up to 10kW with 10 units
    User-Friendly Interface: Built-in USB and optional IEEE interfaces
    Compliance: EN61010-1 compliant with a two-year warranty

    • Vector Network Analyzer (option up to 26.5GHz)
    • WinCal XE calibration software
    • Uses best measurement practices for optimized measurements
    • Known measurement accuracy traced back to independent standards
    • Supported by the measurement experts to make you successful
    • Best in class RF performance
    • Small benchtop footprint
    • Industry standard calibration techniques
    • Extended 2 Year warranty on FormFactor products for educational customers

     

  • Genius Education Kits Overview

     

    • Flexibility
      • Temperatures range from -60°C to +300°C
      • Surfaces are nickel or gold-plated
      • Hybrid chuck design – operation with and without cooling unit
      • Field-upgradeable: On-site cold upgrades for all main prober platforms
    • Highest Efficiency for Reduced Cost of Test
      • Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
      • Up to 15% faster transition times than other systems on the market
    • Low Thermal Resistance
      • Low Thermal Resistance Technology
      • MultiSense with multiple temperature sensors
      • Best temperature accuracy and uniformity
    • Superior Electrical Performance
      • Isolated from ground
      • Includes a jack for grounding and biasing
      • Highly planar chuck surface for consistant contact force and overtravel

     

  • PureLine 3 Technology

    First automated probe station to achieve -190dB spectral noise*

    Plug In and Go

    Integrated TestCell Power Management provides fully managed and filtered AC power to the entire system, prober and instruments

    Autonomous 24/7 Operation

    Up to 4x faster flicker noise thermal testing on 30 μm pads

    Reduce Setup Time and Costs
    Exclusive low noise site survey, and system verification services

     

    • Quick and easy probe tip navigation
    • Maximizes field-of-view
    • High magnification
    • Shadow-free view of the corresponding features
    • Automatically configure and optimize performance
    • cTUVus certified and CE
    • Compatible with TopHat for perfect shielding
    • 24/7 operating, Increased MTBF
    • Stops all system motion and warns of unobserved contact

     

  •  

    Contact Intelligence

    • Ease of use –  Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
    • Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
    • Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.

     

     

    • Highest accuracy with backlash-free positioning
    • Drift-free measurements over temperature and time*
    • Easy, and safe swapping between arms
    • Best signal integrity using optimized probe cabling systems
    • Full thermal capability*
    • Manual or progammable

     

    • Ease of use –  Less experienced operators can perform an RF calibration up to 330 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
    • Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
    • Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
    • Calibration Monitor and Re-calibration – System will continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.

     


Showing 1–12 of 70 results