Semiconductor Test

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  • The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.

    • Re-configurable for DC, RF, mmW, FA, WLR and more
    • table and repeatable measurements over a wide thermal range
    • Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
    • Minimize AC and spectral noise
    • Manual 3-axis stage with ergonomic controls
    • Fast, accurate “hands on” wafer positioning
    • Quick, safe, and comfortable wafer access

     

    • Comfortable and ergonomic operation
    • Thermal range ambient to +300°C
    • RF/microwave device characterization, FA and design debug
    • Seamless integration between Velox and analyzers/measurement software
    • Complete solutions using probe positioners and probe cards
    • Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
    • Shortest signal path test integration for accurate, thermally stable, and low-error data collection
    • Powerful automation tools, reduce total test time on wafers, singulated dies, and modules
    • Faster time to first data for standard and “hard to test” devices such as thin wafer, small pad and high power
    • Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact

     

    • On-wafer power device characterization up to 10,000 V DC / 600 A
    • Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
    • Prevent thin wafers from curling and breaking
    • Accurate Rds(on) measurement at high current
    • Accurate UIS measurements at high temperature
    • Roll-out stage for full wafer access and easy wafer loading/unloading
    • Seamless integration between Velox and analyzers/measurement software
    • High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
    • Easy on-screen navigation, wafer mapping, and operation of accessories with Velox
  • Enabling single-contact high-current/high-voltage test

    • Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
    • Even distribution of high current with innovative multi-fingertip design
    • Compatible with Tesla 200/300 mm power device characterization system
    • Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
    • Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
    • Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

     


Showing all 5 results